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3D IC技術發展新趨勢

2010/08/06
3336
93

陳玲君

#stack #封裝 #vendors

簡報大綱

簡報內容

3D IC技術發展新趨勢 — NO.1

Agenda — NO.2

IC Shipments By Package Category — NO.3

IC Package Value Trend — NO.4

Package Interconnect Evolution — NO.5

3D IC Application Market — NO.6

Players in various 3D IC applications — NO.7

2009 3D IC Market Status — NO.8

Schedule for Applications Adopting TSV — NO.9

Devices vs. TSV Adoption Status — NO.10

Agenda — NO.11

The Markets for 3D IC — NO.12

ASE SiP Roadmap — NO.13

SiP By Applications vs. Cell Phone as Focus — NO.14

Wireless Packaging Technology Evolution — NO.15

Integration Trends for Cell Phones — NO.16

Cell Phones are Driving Packaging Technology — NO.17

Package Trends on Baseband/ Application Processor for Cell Phones — NO.18

CMOS Image Sensor Applications — NO.19

Toshiba-Chip Scale Chip Module — NO.20

CMOS BSI Process Flow — NO.21

BSI (Back Side Illumination) for CIS — NO.22

BSI for CIS Applications — NO.23

3D-WLP MEMS & Forecast per Application — NO.24

3D Integration in MEMS Applications — NO.25

Agenda — NO.26

Demand on Tera-scale by Intel — NO.27

Packaging Bandwidth Options of PC — NO.28

Terabyte Computing System Framework in 2015 — NO.29

Elpida, PTI, and UMC Partner on 3D IC Logic+DRAM Integration Solution including 28nm — NO.30

Powertech SiP Package Roadmap — NO.31

DRAM Stacked package technology trends — NO.32

Stacked DRAM Module Applications — NO.33

Agenda — NO.34

Global LED Demand Forecast by Category — NO.35

HB-LED: Silicon interposer WLP modules — NO.36

3D Opportunities in Automotive Applications — NO.37

3D Opportunities in Medical Applications — NO.38

e-CUBES Application Demonstrators — NO.39

Agenda — NO.40

Supply Chain Infrastructure Evolution — NO.41

3D IC Technologies in ITRI — NO.42

TSMC 3D TSV Plans — NO.43

STATSChipPAC 3D Integration Roadmap — NO.44

台灣應由終端市場需求出發，做元件技術投入 — NO.45

Summary — NO.46

Thank you for your attention! — NO.47

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