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        3D IC技術發展新趨勢
        • 2010/08/06
        • 3341
        • 93

        簡報大綱

        簡報內容

        3D IC技術發展新趨勢
        NO.1
        Agenda
        NO.2
        IC Shipments By Package Category
        NO.3
        IC Package Value Trend
        NO.4
        Package Interconnect Evolution
        NO.5
        3D IC Application Market
        NO.6
        Players in various 3D IC applications
        NO.7
        2009 3D IC Market Status
        NO.8
        Schedule for Applications Adopting TSV
        NO.9
        Devices vs. TSV Adoption Status
        NO.10
        Agenda
        NO.11
        The Markets for 3D IC
        NO.12
        ASE SiP Roadmap
        NO.13
        SiP By Applications vs. Cell Phone as Focus
        NO.14
        Wireless Packaging Technology Evolution
        NO.15
        Integration Trends for Cell Phones
        NO.16
        Cell Phones are Driving Packaging Technology
        NO.17
        Package Trends on Baseband/ Application Processor  for Cell Phones
        NO.18
        CMOS Image Sensor Applications
        NO.19
        Toshiba-Chip Scale Chip Module
        NO.20
        CMOS BSI Process Flow
        NO.21
        BSI (Back Side Illumination) for CIS
        NO.22
        BSI for CIS Applications
        NO.23
        3D-WLP MEMS & Forecast per Application
        NO.24
        3D Integration in MEMS Applications
        NO.25
        Agenda
        NO.26
        Demand on Tera-scale by Intel
        NO.27
        Packaging Bandwidth Options of PC
        NO.28
        Terabyte Computing System Framework in 2015
        NO.29
        Elpida, PTI, and UMC Partner on 3D IC Logic+DRAM Integration Solution including 28nm
        NO.30
        Powertech SiP Package Roadmap
        NO.31
        DRAM Stacked package technology trends
        NO.32
        Stacked DRAM Module Applications
        NO.33
        Agenda
        NO.34
        Global LED  Demand Forecast by Category
        NO.35
        HB-LED: Silicon interposer WLP modules
        NO.36
        3D Opportunities in  Automotive Applications
        NO.37
        3D Opportunities in Medical Applications
        NO.38
        e-CUBES Application Demonstrators
        NO.39
        Agenda
        NO.40
        Supply Chain Infrastructure Evolution
        NO.41
        3D IC Technologies in ITRI
        NO.42
        TSMC 3D TSV Plans
        NO.43
        STATSChipPAC 3D Integration Roadmap
        NO.44
        台灣應由終端市場需求出發,做元件技術投入
        NO.45
        Summary
        NO.46
        Thank you for your attention!
        NO.47

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