IEK View:迎AI時代 先進半導體封裝技術及材料成關鍵
- 2025/02/21
- 164
- 3
高階半導體晶片的高速性能已經成為AI技術與應用的核心驅動力,也促使生成式AI的崛起。而生成式AI對高速運算能力和大規模資料處理的市場需求,促使高效能運算(HPC)晶片技術不斷進步,也帶動了先進封裝技術發展。
高階半導體晶片的高速性能已經成為AI技術與應用的核心驅動力,也促使生成式AI的崛起。而生成式AI對高速運算能力和大規模資料處理的市場需求,促使高效能運算(HPC)晶片技術不斷進步,也帶動了先進封裝技術發展。
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