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Advanced packaging technology refers to the packaging of multiple chips in horizontal or vertical arrangements to increase overall transistor density. As technology progresses, packaging techniques have evolved from traditional single-chip packaging to advanced packaging that integrates multiple chips for higher transistor density and performance. Compared to traditional packaging, advanced packaging requires more equipment and techniques from front-end semiconductor processes, such as Through-Silicon Via (TSV) and Redistribution Layer (RDL). The industry even describes these new processes as "mid-end”. As a result, leading outsourced semiconductor assembly and test (OSAT) companies such as ASE and Amkor are investing in advanced packaging. Leading foundries such as TSMC, Intel and Samsung Electronics are also key suppliers of advanced packaging.