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        FThe Global Trends for Display, Touch and 3D-IC
        平面顯示器、觸控技術、3D-IC的全球趨勢
        • 2013/09/24
        • 7095
        • 782

        簡報大綱

        Stephen Su, General Director of IEK, delivered a keynote presentation on “The Global Trends for Display, Touch, and 3D-IC.” In this presentation, Stephen first shared IEK researchers’ view on future global trends for 3C products. Then he talked about emerging development trends for Display, Touch, and 3D-C, and Taiwan’s current technology and industry status in these industries. He stated that ITRI has made important development progress with these technology by collaborating with domestic and international partners. At the end, he emphasized a few key messages:

        • We live in the internet-world with faster changes in product lifecycles.
        • Display to evolve from LCDs to AMOLEDs, and from flat to flexible panels.
        • The glass and film touch technologies will co-exist in market over the next few years.
        • The 3D-IC packaging technology to evolve from wire bond, flip chip, embedded WLP to TSV.

        Outline:

        • Overview of Global Trends in 3C
        • žDevelopment Trends for Display
        • žDevelopment Trends for Touch
        • žDevelopment Trends for 3D-IC
        • žConclusion

        簡報內容

        The Global Trends forDisplay, Touch and 3D-IC
        NO.1
        Agenda
        NO.2
        3C Market growth remains a two-horse race
        NO.3
        Faster changes for consumer electronics
        NO.4
        Middle and low-end segments drive growthof Smartphones & Tablets
        NO.5
        Smart Handheld Devices: Multi-functions, energy saving, light and small, low cost
        NO.6
        We live in the internet-worldWhat is next after mobile internet?
        NO.7
        ICT-enabled Smart Life: Evolution by M2M, M2H, H2M, H2H
        NO.8
        Next-generation HMI focuses on combination of senses
        NO.9
        McKinsey: 12 Disruptive technologies totransform global economy in 2025
        NO.10
        New paradigm: ICT enabling “Service-based Application Ecosystems”
        NO.11
        Market premium for those playersin control of ecosystems
        NO.12
        Agenda
        NO.13
        Applications for Display: Declining LCD TVs,Rising Smartphones and Tablet PCs
        NO.14
        Display technology trends: Flattening LCD, Increasing AMOLED and Flexible Display
        NO.15
        Evolution of Display Waves:From CRT, LCD to OLED
        NO.16
        Possible milestones for Flexible Display products vs. technology
        NO.17
        Possible design for Flexible Display products
        NO.18
        ITRI leads the development of Flexible AMOLED in Taiwan
        NO.19
        Moderate growth for TFT-LCD material Transitioning to Touch, Flexible, R2R materials
        NO.20
        Agenda
        NO.21
        Rise of Smartphones and Tablet PCspromotes growth of Touch Panels
        NO.22
        Trend for Touch Panels: Glass and film technologies will co-exist in market
        NO.23
        Structure trends for Touch: Low cost, light & thin, ultra-thin bezel
        NO.24
        Taiwan industry ranks firstamong competitive nations
        NO.25
        ITRI leads the Roll-to-Roll (R2R)flexible touch solution in Taiwan
        NO.26
        Trend for Touch Panel materials:New entrants, new tech, new materials
        NO.27
        Outlines
        NO.28
        More Moore vs. More than Moore3D-IC will be the next wave in semiconductor
        NO.29
        3D-IC roadmap for mobile devices:More Moore vs. More than Moore
        NO.30
        Top-3 3D-IC applications:Smartphones, Tablets, Servers
        NO.31
        Evolution of packaging technology: Wire Bond →Flip Chip→ Embedded WLP→TSV
        NO.32
        3D-IC key technology & materials: TSV, Bonding, Interposer, and Wafer Handling
        NO.33
        Taiwan semiconductor industry has advantages to foster 3D-IC technology
        NO.34
        ITRI and Ad-STAC play important roles for development of 3D-IC ecosystem
        NO.35
        Status of 3D-IC process equipment & material
        NO.36
        Rapid growth for 3D-IC Material
        NO.37
        Agenda
        NO.38
        Conclusion:Implications for Taiwan Industry
        NO.39
        Potential international R&D collaboration
        NO.40
        Thank You
        NO.41

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