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        FNext Step for Taiwan Memory Industry
        台灣記憶體產業的下一步
        • 2013/09/06
        • 5674
        • 413

        簡報大綱

        Stephen Su, General Director of IEK, delivered a keynote presentation on “Next Step for Taiwan Memory Industry” at the 2013 Joint Symposium of e-Manufacturing & Design Collaboration and ISSM. In this presentation, Stephen talked about Taiwan’s current DRAM industry overview and worldwide trends. Then he described the status of ITRI’s research progress in MRAM and RRAM. At the end, he emphasized two main messages:

        • Taiwan need to develop next-generation memory, but need to collaborate with international partners via transnational alliance (e.g. IMEC-like set-up in Free Economic Demonstration Zone ).
        • Without proper transnational alliance, Taiwan should not develop next-generation memory, except for embedded memory and 3D memory.

        Outline:

        • Taiwan DRAM industry overview
        • Worldwide DRAM market status and development trend
        • Prospect of emerging memory development
        • Possible direction and strategy for Taiwan memory industry
        • Conclusion

        We are very pleased to present his presentation in PDF format for your reference.

        簡報內容

        Next Step for Taiwan Memory Industry
        NO.1
        Executive Summary
        NO.2
        Outline
        NO.3
        Since 2004 Taiwan DRAM shares dropped to single digit
        NO.4
        Though small portion in DRAM brand share, Taiwan’s DRAM manufacturing remains influential
        NO.5
        2013 Taiwan DRAM fab capacity share forecast
        NO.6
        Taiwan DRAM CAPEX keeps momentum
        NO.7
        Outline
        NO.8
        Surge of cloud services will drive server/mobile DRAM growth
        NO.9
        DRAM spot price has been rising until July in 2013
        NO.10
        DRAM business getting tougher, 2015 a critical year
        NO.11
        Outline
        NO.12
        DRAM scaling issue is about to come
        NO.13
        3D DRAM / HMC Approach (DRAM + Logic)
        NO.14
        Potential new stars of next-generation memory
        NO.15
        MRAM technology developing at ITRI
        NO.16
        RRAM technology developing at ITRI
        NO.17
        Can STT-MRAM replace DRAM(eDRAM)?Only Endurance and Capacity are lagging
        NO.18
        Can RRAM replace NAND Flash?Only Retention needs improvement
        NO.19
        Outline
        NO.20
        Possible direction and strategy for Taiwan memory industry
        NO.21
        Key Technology : 3D Memory, Next-Generation Memory
        NO.22
        Outline
        NO.23
        Conclusion
        NO.24
        Thank you
        NO.25

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