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        FStrengthening Semiconductor Ties with Japan through Opportunities and Challenges
        從半導體發展趨勢強化未來台日合作機會
        • 2024/09/04
        • 118
        • 19
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        IC產業全球市場商機與產業布局

        簡報大綱

        • WW Market Trends

        • Collaboration between Japan and Taiwan 

        簡報內容

        Strengthening Semiconductor Ties with Japan through Opportunities and Challenges
        NO.1
        Outline
        NO.2
        Semiconductors: Pioneering and Embracing Green and Digital Transformation
        NO.3
        WW Semiconductor Market Outlook
        NO.4
        Worldwide Foundry Market Forecast_Equipment Perspective
        NO.5
        Leading Edge Node Drives the Future
        NO.6
        Key Application Driving Semiconductor Market
        NO.7
        AI Semiconductor Market
        NO.8
        Advanced Packagingwill be over 50% of Overall Packaging Market by 2026
        NO.9
        Outline
        NO.10
        Joint Approach to Emerging Applications
        NO.11
        Etching, Deposition, and Lithography: Key Technologies Driving the Market
        NO.12
        Conclusion:
        NO.13
        謝謝
        NO.14
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