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3D IC新市場機會與挑戰

2011/07/27
4335
471

陳玲君

#dram #mems #wafer

簡報大綱

簡報內容

(無標題) — NO.1

Outline — NO.2

(無標題) — NO.3

IC package portfolio trends — NO.4

3D IC market will exceed US$4 billion in 2015 — NO.5

Global 3D glass / silicon interposers wafer forecasts by application — NO.6

Global Wafer Bumping demand — NO.7

3D Silicon/Glass Interposers: A bridging technology between the silicon and the organic worlds — NO.8

Supply chain for 3D interposer suppliers — NO.9

Amkor: 3D interposer supply chain logistics — NO.10

Roadmaps for 2.5D and 3DIC commercialization — NO.11

Outline — NO.12

3D IC applications — NO.13

[Application 1] CMOS Image Sensors — NO.14

CIS Supply Chain in Taiwan — NO.15

iPhone4-BSI(Back Side Illumination) for CIS — NO.16

(無標題) — NO.17

3D-WLP MEMS devices forecast per application — NO.18

Early adoption of 3D MEMS for Handsets — NO.19

MEMS Packaging Trends and major MEMS foundries — NO.20

(無標題) — NO.21

Xilinx ’s passive interposers with TSV in FPGA — NO.22

Xilinx 2.5D FPGA Supply ChainLeading foundry and OSAT partners — NO.23

(無標題) — NO.24

WW DRAM market share and 3D DRAM activities — NO.25

Samsung 32GB DDR3 Memory Module for Low Power Server Operations — NO.26

(無標題) — NO.27

Video & Display Resolution vs. Memory Bandwidth — NO.28

ARM Core & Low Power DRAM:Parallel Performance Growth — NO.29

Smartphone Application Processors — NO.30

Mobile DRAM forecast — NO.31

Samsung 12.8GB/s Mobile Wide-I/O DRAM with 512 I/Os Using TSV-Based Stacking — NO.32

ISSCC 2011, Samsung announced 1Gbit DRAM in a 3D TSV package — NO.33

(無標題) — NO.34

Elpida, PTI, and UMC Partner on 3D IC Logic+Memory Integration Solution — NO.35

(無標題) — NO.36

3DIC Tool-Box: Synthesis of Key Challenges — NO.37

Outline — NO.38

(無標題) — NO.39

(無標題) — NO.40

(無標題) — NO.41

(無標題) — NO.42

The application of ASET Dream Chips — NO.43

e-CUBES Application Demonstrators — NO.44

(無標題) — NO.45

Industry Collaboration for TSV Development in IME — NO.46

(無標題) — NO.47

Ad-STAC: A virtual IDM common platform for boosting Taiwan 3D IC Industry — NO.48

ITRI: Taiwan’s 1st 12 inch full 3DIC TSV integration line — NO.49

(無標題) — NO.50

(無標題) — NO.51

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